发明名称 |
MANUFATURING METHOD FOR EMBEDDED PRINTED CIRCUIT BOARD AND CARRIER BOARD USED FOR THE METHOD |
摘要 |
PURPOSE: A method for manufacturing an embedded printed circuit board and a carrier substrate used therefore are provided to stabilize a process by using a stainless steel carrier substrate. CONSTITUTION: A carrier substrate is manufactured by forming plating layers(120,130) on both sides of a stainless steel(110). An element(140) is mounted on one surface of the carrier substrate. An insulating layer(150) is laminated on an upper surface of the carrier substrate. A metal layer(160) is laminated on an upper surface of the insulating layer. The plating layer in which the stainless steel and the element are not mounted is removed. A circuit pattern is formed on the metal layer.
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申请公布号 |
KR20110065712(A) |
申请公布日期 |
2011.06.16 |
申请号 |
KR20090122333 |
申请日期 |
2009.12.10 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
CHUN, JIN GOO;KIM, HYUNG JONG;PARK, JUN SOO;LEE, KI YONG;YOO, JAE HYOUN |
分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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