| 摘要 |
PROBLEM TO BE SOLVED: To attain a semiconductor integrated device with low production unit cost and narrow footprint by optimizing the arrangement relation of diodes and current limiting resistors thereby reducing the semiconductor integrated device in the direction of short side. SOLUTION: The layout of an electrostatic protection circuit 10 capable of reducing the dimensions of the semiconductor integrated device in the direction of short side can be obtained by dividing a diode to reduce the size of each divided diode and by arranging current limiting resistors 6 in the lateral direction between the divided diodes 1 and 2 arranged in the lateral direction and between the divided diodes 3 and 4 arranged in the lateral direction. COPYRIGHT: (C)2011,JPO&INPIT
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