发明名称 FILM DEPOSITION SYSTEM AND FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method which can safely perform film deposition when a thin film is deposited with a film deposition raw material dangerous when being reacted with water. SOLUTION: The film deposition system 1 includes: a vacuum chamber 2 storing a base material 9 as the object for film deposition in the inside; a holder 4 holding the base material 9 in the vacuum chamber 2; an evaporation source 3 provided at a position opposing to the holder 4; and a circulation mechanism 40 circulating a refrigerant in the inside of the holder 4. Then, a non-aqueous refrigerant is used as the refrigerant circulated in the inside of the holder 4 in the film deposition system 1. With such constitution, a film deposition raw material evaporated by the evaporation source 3 can be deposited on the surface of the base material 9 while cooling the base material 9 held by the holder 4, and safety can be secured upon the film deposition. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011117058(A) 申请公布日期 2011.06.16
申请号 JP20090277867 申请日期 2009.12.07
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KANNO TAKESHI;AWATA HIDEAKI;SHIBATA KAORU;UEDA MITSUHO;TAKEYAMA TOMOHARU;KIMURA KOTARO
分类号 C23C14/50;C23C14/14;C23C14/24;C23C14/34;C23C16/46 主分类号 C23C14/50
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