发明名称 |
FILM DEPOSITION SYSTEM AND FILM DEPOSITION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method which can safely perform film deposition when a thin film is deposited with a film deposition raw material dangerous when being reacted with water. SOLUTION: The film deposition system 1 includes: a vacuum chamber 2 storing a base material 9 as the object for film deposition in the inside; a holder 4 holding the base material 9 in the vacuum chamber 2; an evaporation source 3 provided at a position opposing to the holder 4; and a circulation mechanism 40 circulating a refrigerant in the inside of the holder 4. Then, a non-aqueous refrigerant is used as the refrigerant circulated in the inside of the holder 4 in the film deposition system 1. With such constitution, a film deposition raw material evaporated by the evaporation source 3 can be deposited on the surface of the base material 9 while cooling the base material 9 held by the holder 4, and safety can be secured upon the film deposition. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011117058(A) |
申请公布日期 |
2011.06.16 |
申请号 |
JP20090277867 |
申请日期 |
2009.12.07 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
KANNO TAKESHI;AWATA HIDEAKI;SHIBATA KAORU;UEDA MITSUHO;TAKEYAMA TOMOHARU;KIMURA KOTARO |
分类号 |
C23C14/50;C23C14/14;C23C14/24;C23C14/34;C23C16/46 |
主分类号 |
C23C14/50 |
代理机构 |
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