发明名称 Packaging of Silicon Wafers and Mating Pieces
摘要 By creating a package (MVLC) that has a redundant set of pins, twice as many points of contact are generated. More contacts create more routing and component placement options. Incorporating slots on the underside of the MVLC will promote radiation under the MVLC. By creating a mating piece (a Saddle) discrete components can be moved to a more desirable area of the main printed circuit board or placed in and on the Saddle itself. A Saddle may or may not require a flex circuit. A Saddle could be no more than a flex circuit. Positioning capacitors in particular on the Saddle makes a supply current become more effective, which improves performance. All of the Saddle layers are designed to enhance performance and/or reduce the member of discrete components required on the main printed circuit board near the MVLC. In general, creating more usable room on the main printed circuit board promotes a better design and invites circuit expansion.
申请公布号 US2011140265(A1) 申请公布日期 2011.06.16
申请号 US20090635562 申请日期 2009.12.10
申请人 SCHEBER GEORGE DENNIS 发明人 SCHEBER GEORGE DENNIS
分类号 H01L23/498 主分类号 H01L23/498
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