ADHESIVE TAPE JOINING METHOD AND APPARATUS USING THE SAME

摘要

A tape cutting mechanism cuts an adhesive tape joined to a semiconductor wafer along a contour of the wafer. A rotary encoder detects a rotating angle of each side roller for guiding a narrow region on both ends of an adhesive tape during winding up and collecting a cutout unnecessary tape. A determination section determines a fracture in the narrow region of the unnecessary tape through comparison between an actual rotating angle as a result of the detection and a preset reference rotating angle.