| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and typical utilization thereof, the photosensitive resin composition being obtained without using a halogen-based flame retardant but by using a reactive flame retardant of simultaneously achieving various physical properties, such as heat resistance, hydrolysis resistance, processability (including solvent solubility), and adhesion; and photosensitivity; flame retardancy; pliability; flexibility; and sufficient mechanical strength, and sufficiently dealable with downsizing and weight reduction of electronic parts in electronic equipment. <P>SOLUTION: The reactive flame retardant containing (a) phosphazene structure, (b) a photosensitive group, and (c) a urethane bond in a molecule is used. <P>COPYRIGHT: (C)2011,JPO&INPIT |
