| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow device capable of manufacturing mounting substrates of different kind while suppressing increases in arrangement space and facility investment expenditure. SOLUTION: This invention relates to the reflow device 10 that heats substrates 12, 14 having components arranged through bonding materials while carrying them, and the reflow device 10 includes a heating furnace 18 having heating spaces 32, 44 for heating the substrates 12, 14, a first carrier 24 having a pair of carrying rails 72 whose interval is variable and carrying the substrates 12, 14 so that they pass through the heating spaces 32, 44, a second carrier 26 arranged in the heating spaces 32, 44 side by side with the first carrier 24, having a pair of carrying rails 88 whose interval is variable, and carrying the substrates 12, 14 so that they pass through the heating spaces 32, 44, and a partition 27 provided between the first carrier 24 and second carrier 26 to partition off the heating spaces 32, 44, and changing a partitioning position of the heating spaces 32, 44 in accordance with the interval of the first carrying rails 72. COPYRIGHT: (C)2011,JPO&INPIT |
