| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress scattering of an end material in a floating direction from a support member when a substrate is diced into semiconductor devices using a dicing blade. <P>SOLUTION: The support member 210 supports, on one surface side, the substrate 10 to be divided into the semiconductor devices. The dicing blade 220 dices the substrate 10 into the plurality of semiconductor devices 100 by dividing the substrate 10 held by the support member 210 along dicing lines 120 provided to the substrate 10. An edge of one surface of the support member 210, i.e. the surface supporting the substrate 10 overlaps a semiconductor device 100 positioned at an outermost periphery of the substrate 10 in plane view, and is positioned inside the substrate 10 with respect to a dicing line 120 positioned at the outermost periphery of the substrate 10. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
