发明名称 |
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME |
摘要 |
Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.
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申请公布号 |
US2011138621(A1) |
申请公布日期 |
2011.06.16 |
申请号 |
US20100720567 |
申请日期 |
2010.03.09 |
申请人 |
CHO SEONG MIN;SOHN KEUNG JIN;BAE TAE KYUN;HONG HYUN JUNG;LEE KYUNG AH;OH CHANG GUN |
发明人 |
CHO SEONG MIN;SOHN KEUNG JIN;BAE TAE KYUN;HONG HYUN JUNG;LEE KYUNG AH;OH CHANG GUN |
分类号 |
H05K3/10;B05D5/12;B23K31/00;B32B15/00;B32B15/20 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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