| 摘要 |
<p>Conventionally, when mounting by reflow soldering a resin substrate with built-in electronic components, the solder that was used in mounting the built-in electronic components is heated, and said solder re-melts and expands, shorting the terminal electrodes of the electronic component; the invention solves this problem. Vias (7a, 7b), one end of which contacts the solder (5a, 5b) which connects to and fixes the built-in electronic component (3), and the other end of which is sealed by a sealing member layer (8), are formed in the resin layer (6). The phenomenon of solder splash is prevented from occurring by allowing the re-melted solder to flow into and remain in the vias (7a, 7b).</p> |
