Leistungselektroniksubstrat für direkte Substratkühlung
摘要
<p>Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.</p>
申请公布号
DE102010043904(A1)
申请公布日期
2011.06.16
申请号
DE20101043904
申请日期
2010.11.15
申请人
GM GLOBAL TECHNOLOGY OPERATIONS LLC
发明人
LE, KHIET;WARD, TERENCE G.;MANN, BROOKS S.;YANKOSKI, EDWARD P.;SMITH, GREGORY S.