| 摘要 |
<p>The invention relates to a multipole relief plug-in connector (10a, 10b) and to a multilayer circuit board (12a, 12b), the relief plug-in connector (10a, 10b) comprising a plurality of contact elements (14a, 14b), the contacting sections (16a, 16b) of which are arranged in height-offset contact area surfaces (18a, 18b), and the multilayer circuit board (12a, 12b) comprising several height-offset contact area surfaces (20, 20b) accordingly, and to a combination of a multipole relief plug-in connector (10a, 10b) for contacting with a multilayer circuit board (12a, 12b) and a multilayer circuit board (12a, 12b) for populating with the multipole relief plug-in connector (10a, 10b). The relief plug-in connector (10a, 10b) according to the invention is characterized in that the contact elements (14a, 14b) are designed in the contacting section (16a, 16b) as press-in contacts (22a, 22b, 26a, 26b, 28a, 28b) for pressing into press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b) of the multilayer circuit board (12a, 12b). The multilayer circuit board (12a, 12b) is characterized in that contact element receiving portions are arranged in the contact area surfaces (20a, 20b) of the multilayer circuit board (12a, 12b), the contact element receiving portions being designed as press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b). The invention further relates to a production method for the multilayer circuit board (12a, 12b).</p> |
