| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting die bond film which can prevent the generation of a void on the boundary of die bond film and can improve the adhesion reliability of an adherend and semiconductor chip even when exposed to a high temperature for a long time. <P>SOLUTION: The thermosetting die bond film at least includes an adhesive layer to be used for fixing a semiconductor chip on an adherend, wherein the adhesive layer contains an epoxy resin and phenol resin as thermosetting resins, as well as an acrylic resin as a thermoplastic resin having a weight-average molecular weight of 100,000 or more, and wherein X/Y is 0.07-0.7 when the total weight of epoxy resin and phenol resin is X, and the weight of acrylic resin is Y, and the reduction ratio of epoxy group after undergoing an one-hour heat treatment at 175°C is 60% or less relative to the amount before the heat treatment. <P>COPYRIGHT: (C)2011,JPO&INPIT |
