| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for mounting semiconductor elements which is capable of suppressing poor connection of optical semiconductor elements and warpage of the substrate, while suppressing productivity deterioration. <P>SOLUTION: The method of manufacturing a substrate 10 for mounting optical semiconductor elements includes a wiring member arrangement process that arranges the backsides 12b of the wiring member 12 with an optical semiconductor element mounting region for disposing optical semiconductor elements 20 on the front surface 12a so that they face each other through an adhesive film 50, a mold arrangement process that arranges the protrusion of the mold to contact the optical semiconductor element mounting region and to oppose a pair of molds each other through a wiring member 12 and the adhesive film 50, and a compact forming process in which a thermosetting resin composition fills up the concave part of the mold and a compact is formed on the front surface 12a of the wiring member 12 by transfer molding. <P>COPYRIGHT: (C)2011,JPO&INPIT |
