发明名称 SEMICONDUCTOR APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a semiconductor apparatus which has a high reliability and can operate at a high temperature. SOLUTION: A semiconductor apparatus has: a substrate 1; a semiconductor element 2 that is mounted on the substrate 1 and generates heat equal to or more than 200°C; a surrounding part 4 that surrounds the semiconductor element 2; and a liquid sealing part 6 having a flow controlled by the surrounding part 4, which is used to seal the semiconductor element 2 and configured by heat-resistant oil. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011119345(A) 申请公布日期 2011.06.16
申请号 JP20090273579 申请日期 2009.12.01
申请人 YASKAWA ELECTRIC CORP 发明人 AKIYOSHI KENJO
分类号 H01L23/44 主分类号 H01L23/44
代理机构 代理人
主权项
地址