| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low cost method for manufacturing a solid-state imaging apparatus capable of achieving a good image. <P>SOLUTION: The method includes: a step of forming a plurality of photoelectric conversion sections between a first conduction type first semiconductor area and a first surface of a substrate having the first semiconductor area between the first surface and a second surface opposing to the first surface; a first removal step of grinding the substrate from the second surface side of the substrate; and a second removal step of further thinning the substrate from the second surface side at a machining speed slower than that of the first removal step, after the first removal step, wherein the second step is finished when the first semiconductor area is exposed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
