发明名称 PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE LAYER, AND PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a photocurable pressure-sensitive adhesive composition formable of a pressure-sensitive adhesive layer which does not cause squeeze-out of glue or the like under ordinary temperature and pressure conditions, has sufficient initial tack via drying and cross-linking, is easily cured by irradiation with light, and exhibits high peeling resistance after curing, to provide a photocurable pressure-sensitive adhesive layer, and to provide a photocurable pressure-sensitive adhesive sheet or the like. <P>SOLUTION: The photocurable pressure-sensitive adhesive composition contains: a graft polymer, obtained by graft-polymerizing a chain including a cyclic ether group-containing monomer to a (meth)acrylic polymer containing a hydroxyalkyl(meth)acrylamide monomer in an amount of 0.2-10 wt.% as monomer unit, and a photo-cationic polymerization initiator. The photocurable pressure-sensitive adhesive layer using the composition, and the photocurable pressure-sensitive adhesive sheet with the adhesive layer are provided. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011116863(A) 申请公布日期 2011.06.16
申请号 JP20090275842 申请日期 2009.12.03
申请人 NITTO DENKO CORP 发明人 FUJITA SHIGERU;MOROISHI YUTAKA;NAKANO FUMIKO;INOUE TETSUO
分类号 C09J151/00;C08F265/06;C09J7/02;C09J11/06 主分类号 C09J151/00
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