BINDER COMPOSITION FOR ELECTRODES AND MIXTURE SLURRY FOR ELECTRODES

摘要

Disclosed is a binder composition for electrodes, which has high binding power and does not inhibit the formation of a stable interface (SEI) at the surface of an active material. Specifically disclosed is a binder composition for electrodes, which contains at least one tetracarboxylic acid ester compound, at least one diamine compound and an organic solvent. It is preferable for the organic solvent to have a boiling point of not more than 250°C. It is also preferable for the organic solvent to have a highest occupied molecular orbital (HOMO) of not more than -10 eV.