| 摘要 |
An electronic device (100) comprises a plurality of integrated circuit dies (110, 120, 130) mounted on different areas of a carrier (150). The carrier (150) is folded into a plurality of layers, each layer comprising one of the different areas of the carrier (150) and one of the integrated circuit dies (110, 120, 130), such that the plurality of integrated circuit dies (110, 120, 130) form a stack. Adjacent surfaces of neighbouring layers are fixed together, for example by an adhesive layer (122, 132), and the folded carrier (150) and the integrated circuit dies (110, 120, 130) are embedded in a moulded material (180). |
