METHOD TO REMOVE CAPPING LAYER OF INSULATION DIELECTRIC IN INTERCONNECT STRUCTURES
摘要
<p>A method for patterning an insulation layer and selectively removing a capping layer overlying the insulation layer is described. The method utilizes a dry non-plasma removal process. The dry non-plasma removal process may include a self-limiting process.</p>
申请公布号
WO2011071825(A1)
申请公布日期
2011.06.16
申请号
WO2010US59114
申请日期
2010.12.06
申请人
TOKYO ELECTRON LIMITED;FEURPRIER, YANNICK;TRICKETT, DOUGLAS, M.
