发明名称 Inter-die interconnection interface
摘要 <p>A die is provided for use in a package comprising said die and at least one further die. The die comprises an interface configured to receive a transaction from the further die via an interconnect and for transmitting a response to the further die via the interconnect. The die also has mapping circuitry configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. The arrangement ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.</p>
申请公布号 EP2333671(A1) 申请公布日期 2011.06.15
申请号 EP20100305122 申请日期 2010.02.05
申请人 STMICROELECTRONICS (GRENOBLE 2) SAS;STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED 发明人 URZI, IGNAZIO ANTONINO;D'AUDIGIER, PHILIPPE;SAUVAGE, OLIVIER;JONES, MICHAEL ANDREW;RYAN, STUART
分类号 G06F13/42;G06F13/38 主分类号 G06F13/42
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