发明名称 |
a package comprising a first and a second die coupled by a multiplexed bus |
摘要 |
<p>A package comprising a first die; a second die; an interface connecting said first die and said second die, at least one of said first and second dies comprising a memory, said interface being configured to transport both control signals and memory transactions; and multiplexing means for multiplexing said control signals and said memory transactions onto said interface such that a plurality of connections of said interface are shared by said control signals and said memory transactions.</p> |
申请公布号 |
EP2333830(A1) |
申请公布日期 |
2011.06.15 |
申请号 |
EP20090425500 |
申请日期 |
2009.12.07 |
申请人 |
STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED;STMICROELECTRONICS S.R.L. |
发明人 |
JONES, ANDREW MICHAEL;RYAN, STUART;SCANDURRA, ALBERTO |
分类号 |
H01L25/00;G06F13/16 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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