| 摘要 |
The device (10) has semiconductor light sources comprising LED chips (14, 16, 18) that are mounted on a chip-cooling substrate (20) that dissipates heat. The chips are surrounded by respective metallic reflector bodies (22, 24, 26), which are connected to the substrate and/or the chips. The bodies are arranged next to one another with respective gaps (30, 32, 34) in a cold state and not connected with one another, where the bodies exhibit uniform wall thickness. Openings of the bodies present at a light emission side lie in one plane. |
