| 摘要 |
PROBLEM TO BE SOLVED: To improve a loading yield of a semiconductor device by preventing faults (non-fusing of solder paste and ball-shaped external terminal supplied to the semiconductor device, bridging of a solder ball, and drop of the solder ball) generated when the semiconductor device is loaded to a loading substrate via the solder ball. SOLUTION: Faults in loading a first BGA10a onto a first principal surface 1x of the loading substrate 1 are prevented by previously measuring a warp of the first BGA10a through first analysis, computing a working curve (relationship between shape and load) for a shape of the solder ball (conductive route) 13 through second analysis, computing an optimum amount of supply of the solder paste (solder paste for semiconductor device) on the basis of the results of the first and second analyses, and supplying the solder paste (solder paste for semiconductor device) respectively to a plurality of bump lands (bump lands for semiconductor device) 3. COPYRIGHT: (C)2011,JPO&INPIT
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