| 摘要 |
PURPOSE: An apparatus and a method for partial bonding of an Anisotropic Conductive Film are provided to improve the productivity of a circuit board transferring work. CONSTITUTION: An apparatus(100) for partial bonding of an Anisotropic Conductive Film comprises a tray supply unit(10), first and second pressing units(20a,20b), a circuit board supply unit(30), and a circuit board discharge unit(40). The tray supply unit supplies trays(TR) with multiple circuit boards(CB). The first pressing unit is installed in one side of the tray supply unit. The second pressing unit is installed in one side of the first pressing unit. The first and second pressing units split and temporarily press an ACF. The circuit board supply unit alternately transfers the circuit boards to the first and second pressing units. The circuit board discharge unit alternately discharges the circuit boards on which the ACF is temporarily pressed.
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