INSPECTING APPARATUS AND METHOD FOR BONDING WIRE IN LIGHT EMITTING DIODE CHIP PACKAGE

摘要

PURPOSE: An apparatus for inspecting bonding wires in a light emitting diode chip package and a method for the same are provided to verify the accurate path of the bonding wires by acquiring images based on light with different wavelengths and integrating the images. CONSTITUTION: A light illuminating part(10) radiates light in a specific wavelength. The light illuminating part is composed of co-axial illumination. A image taking part takes images with respect to the upper side of a light emitting diode chip package(40). A controlling part(30) outputs an on/off controlling signal for the light illuminating part and a synchronizing signal for the image taking part. An image acquiring part acquires the images.