APPARATUS AND METHOD FOR CLEANING WAFER

摘要

PURPOSE: A cleaning device and method thereof are provided to match the end of a nozzle with the direction of a centrifugal force even though nozzle swing starts at a location out of the center of a wafer, thereby increasing cleaning efficiency. CONSTITUTION: A spray head(120) sprays cleaning liquid supplied from a cleaning liquid supply pipe(130). A spray nozzle(140) supplies different cleaning liquid to the cleaning liquid supply pipe. A driving unit drives the spray head. The driving unit includes an arm(160), a forward/backward cylinder unit(170), and a rising/dropping shaft(180). A wafer(110) is placed on a spin head(212) of a chamber(217).