| 摘要 |
The device (10) has semiconductor light sources (12) comprising LED chips (14, 16, 18) that are mounted on a common substrate (20) that dissipates heat. The chips are surrounded by an individual reflector bodies (22, 24, 26), which are connected to the substrate and/or the chips. The bodies are arranged next to one another and are not connected with one another. Surface of the chips are covered by a lens made of transparent refractive material such as silicone, where the surface is designed in dome-shape or hemispherical shape. |
