ANORDNUNG ZUR VERBINDUNG VON LEITERPLATTEN

摘要

The board (ELP) has a contact surface (KF) for contacting a connection element (VE). The surface comprises a central contact point and a concentric ring enclosing the central contact point. The connection element is electrically contacted on a side with another circuit board (ZLP) and includes spring elements (FE1-FE3), where the spring element (FE1) is electrically contacted with the central contact point, and the spring elements (FE2, FE3) are electrically contacted with the concentric ring. The element (FE2) concentrically surrounds the element (FE1). An independent claim is also included for an arrangement of two circuit boards and a connection element.