发明名称 |
Method of attaching an electronic device to an MLCC having a curved surface |
摘要 |
A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.
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申请公布号 |
US7958627(B2) |
申请公布日期 |
2011.06.14 |
申请号 |
US20080236126 |
申请日期 |
2008.09.23 |
申请人 |
KEMET ELECTRONICS CORPORATION |
发明人 |
RANDALL MICHAEL S.;WAYNE CHRIS;MCCONNELL JOHN |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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