发明名称 Integrated circuit, and a mobile phone having the integrated circuit
摘要 In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.
申请公布号 US7961478(B2) 申请公布日期 2011.06.14
申请号 US20050578502 申请日期 2005.04.04
申请人 NXP B.V. 发明人 COUSIN ALAIN
分类号 H05K7/02;H01F17/00;H01L23/10;H01L23/66;H01L25/065;H01L25/16;H03H9/05;H05K7/06;H05K7/08;H05K7/10 主分类号 H05K7/02
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