发明名称 |
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same |
摘要 |
Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.
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申请公布号 |
US7960800(B2) |
申请公布日期 |
2011.06.14 |
申请号 |
US20080334331 |
申请日期 |
2008.12.12 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
GRUENHAGEN MICHAEL D.;KIM SUKU;MURPHY JAMES J.;TJHIA EDDY;WU CHUNG-LIN;LARSEN MARK;DOLAN DOUGLAS E. |
分类号 |
H01L27/088 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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