发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PURPOSE: A substrate processing apparatus is provided to easily correspond the surface roughness of a substrate loading surface when the surface roughness of the substrate loading surface is out of an adequate range. CONSTITUTION: A rotary table(2) rotates inside a vacuum container(1). A substrate loading unit is detachably installed to the rotary table. The substrate loading unit includes a concave part on the upper side of the rotary table. A position restricting part is installed at least one side of the rotary table and the substrate loading unit and restricts the movement of a substrate based on centrifugal force. A reaction gas supplying part supplies reaction gas to the upper side of the rotary table.
申请公布号 KR20110063340(A) 申请公布日期 2011.06.10
申请号 KR20100121260 申请日期 2010.12.01
申请人 TOKYO ELECTRON LIMITED 发明人 OHIZUMI YUKIO;HONMA MANABU
分类号 H01L21/205;H01L21/3065 主分类号 H01L21/205
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