发明名称 |
NOZZLE MODULE AND USING THE SAME NOZZLE ALIGNMENT APPARATUS |
摘要 |
PURPOSE: A nozzle module and a nozzle aligning apparatus using the same are provided to efficiently bond electric parts on a printed circuit board by uniformly apply flux on solder bumps on the electric parts. CONSTITUTION: A nozzle module(100) is composed of a nozzle part(200), a fixing part(300), and a position adjusting part(400). The fixing part is spaced apart from the nozzle part. The position adjusting part connects the nozzle part and the fixing part. The position adjusting part includes a first position adjuster(410) with a spherical shaped protrusion and a second position adjuster(420) with a groove. The groove of the second position adjuster surrounds the protrusion of the first position adjuster. A tightener(430) is included in the position adjusting part in order to apply pressure to the groove.
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申请公布号 |
KR20110062488(A) |
申请公布日期 |
2011.06.10 |
申请号 |
KR20090119229 |
申请日期 |
2009.12.03 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
SHIM, KI WHAN |
分类号 |
H01L21/60;H01L21/02;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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