发明名称 NOZZLE MODULE AND USING THE SAME NOZZLE ALIGNMENT APPARATUS
摘要 PURPOSE: A nozzle module and a nozzle aligning apparatus using the same are provided to efficiently bond electric parts on a printed circuit board by uniformly apply flux on solder bumps on the electric parts. CONSTITUTION: A nozzle module(100) is composed of a nozzle part(200), a fixing part(300), and a position adjusting part(400). The fixing part is spaced apart from the nozzle part. The position adjusting part connects the nozzle part and the fixing part. The position adjusting part includes a first position adjuster(410) with a spherical shaped protrusion and a second position adjuster(420) with a groove. The groove of the second position adjuster surrounds the protrusion of the first position adjuster. A tightener(430) is included in the position adjusting part in order to apply pressure to the groove.
申请公布号 KR20110062488(A) 申请公布日期 2011.06.10
申请号 KR20090119229 申请日期 2009.12.03
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 SHIM, KI WHAN
分类号 H01L21/60;H01L21/02;H05K3/34 主分类号 H01L21/60
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