| 摘要 |
PURPOSE: A method for processing wafers is provided to prevent the outer circumference of wafers from being damaged by bonding the wafers with a protective tape while the rear sides of the wafers are ground. CONSTITUTION: A wheel mount(30) is fixed to the tip end part of a spindle(28) in a grinding device. A grinding wheel(26) is mounted to the wheel mount using a screw(31). The grinding wheel includes a plurality of grinding stones(34) attached to the free end part of a ring shaped base(32). A chuck table(24) rotates to the same direction as the grinding wheel. A grinding unit transferring unit approaches the grinding stones to the rear side of a wafer(11). A protective tape(23) is bonded on the surface of the wafer.
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