| 摘要 |
PURPOSE: A method for manufacturing a flexible circuit board is provided to prevent an undercut phenomenon of the lower part of a wire pattern while increasing plating attaching strength. CONSTITUTION: A seed layer(210) is formed on a base film(200). An underlying layer(220) is formed on the seed layer. A resist pattern(230) exposing an area where a wiring pattern is formed is formed on the underlying layer. The surface of the exposed underlying layer is picked by the resist pattern. A wire pattern(240) is formed on the underlying layer exposed by the resist pattern after the pickling process. The resist pattern and the seed layer are eliminated.
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