| 摘要 |
PURPOSE: A polishing plate with a modified cooling unit wafer polishing apparatus including the same are provided to control the chemical reaction speed of a polishing process by considering mechanical polishing characteristics for each region of a wafer. CONSTITUTION: A polishing plate(100) includes multiple temperature regions(A, B, C) which are formed to the radial direction. Temperature regions forming the multiple temperature regions are respectively controlled by chillers. Temperature regions receive coolant from a first chiller, a second chiller, and a third chiller. The temperature regions respectively maintain cooling temperatures(T1, T2, T3). The cooling temperature with respect to the wafer in contact with the polishing plate is radially defined.
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