| 摘要 |
PURPOSE: A nozzle assembly for injecting melted solder into cavities of a template and a melted solder injecting apparatus including the same are provided to uniformly inject solder melted in mold cavities, thereby increasing the quality of a semiconductor device using solder bumps. CONSTITUTION: A body(210) includes an internal space whose top is opened. The internal space contains solder materials. A body includes a heater for melting the solder materials. A nozzle(220) includes a slit penetrating the flat bottom and the internal space and the bottom of the body. A slit injects solder melted by a heater into mold cavities formed on the surface of the template. A door(230) opens/closes the opened top of the body. A sealing member is arranged between the door and the body.
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