发明名称 |
CONDUCTIVE RESIN COMPOSITION AND CHIP-TYPE ELECTRONIC COMPONENT |
摘要 |
<p>PURPOSE: A conductive resin composition is provided to ensure good shape and to obtain a resin electrode with high shape precision and excellent adhesion to a ceramic device. CONSTITUTION: A conductive resin composition comprising: a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a glycidyl group at a molecular end; a conductive powder having a silver surface; and a solvent, wherein the composition has a yield value of 3.6 Pa or less. The conductive powder has a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less.</p> |
申请公布号 |
KR20110063311(A) |
申请公布日期 |
2011.06.10 |
申请号 |
KR20100118623 |
申请日期 |
2010.11.26 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
OTANI SHINJI;NOMURA AKIHIRO |
分类号 |
H01B1/22;C08L63/00;H01G4/30 |
主分类号 |
H01B1/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|