发明名称 CONDUCTIVE RESIN COMPOSITION AND CHIP-TYPE ELECTRONIC COMPONENT
摘要 <p>PURPOSE: A conductive resin composition is provided to ensure good shape and to obtain a resin electrode with high shape precision and excellent adhesion to a ceramic device. CONSTITUTION: A conductive resin composition comprising: a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a glycidyl group at a molecular end; a conductive powder having a silver surface; and a solvent, wherein the composition has a yield value of 3.6 Pa or less. The conductive powder has a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less.</p>
申请公布号 KR20110063311(A) 申请公布日期 2011.06.10
申请号 KR20100118623 申请日期 2010.11.26
申请人 MURATA MANUFACTURING CO., LTD. 发明人 OTANI SHINJI;NOMURA AKIHIRO
分类号 H01B1/22;C08L63/00;H01G4/30 主分类号 H01B1/22
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