FABRICATING METHOD OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to coat opened solder resist for etch-back, thereby preventing burrs when a router is processed. CONSTITUTION: A first solder resist(120) coated on a substrate(100) is eliminated to expose a plating lead line(110). The exposed plating lead line is eliminated by etching. A second solder resist(130) is coated on a part from which the first solder resist is eliminated. The second solder resist is made of the same material as the first solder resist. The second solder resist is coated by a screen printing method, a roller coating method, a curtain coating method, or a spray coating method.