| 摘要 |
A method for connection a printed board with a framework comprises performing through holes in the printed boards and in the framework, indexing the holes, mechanical connection of the printed board and the framework using a fastening member made of conducting material, and electrical connection of at least one conducting layer of the printed board with conducting layer of the framework via a fastening member. For growth of construction reliability the framework is performed as a dielectric plate with two opposite located conducting layers. An electric connection of the conducting layer of the framework and conducting layer of the printed board faced to each other is made with help of pressing of their surfaces. |
