| 摘要 |
FIELD: chemistry. ^ SUBSTANCE: invention relates to a current-conducting adhesive composition for use in microwave electronics. The current-conducting adhesive composition contains binder based on modified epoxy resin, a diluent, a hardener and metallic filler in form of nanodispersed silver powder. The modified epoxy resin is epoxy-novolak resin. The diluent is diglycidyl ether of the family of laprols. The hardener is a product of reaction between aminophenol and unsaturated organic acids. The composition additionally contains a mixture of a finishing agent and spreading agent in ratio of 1:1, which is a mixture of organophenoxy siloxane and organophenoxy silane, and a solvent selected from polyglycol ethers. ^ EFFECT: current-conducting adhesive composition has high heat- and electroconductivity, heat resistance and manufacturability, low viscosity, while preserving high cohesion strength and high mechanical strength of the adhesive joint. ^ 2 cl, 1 tbl, 5 ex |
