| 摘要 |
A system and method for thermal management of a device under test (DUT). In particular, a system is described for performing optical microscopy. The system includes a heat spreader window that consists of substantially undoped silicon. The window is configured to be coupled to a back side of a substrate of a DUT such that thermal energy from the DUT is spread to the heat spreader window. A contact region is coupled to the heat spreader window. The contact region is configured for contact with a solid immersion lens (SIL) optical system for optical examination of the DUT. A heat exchanger is coupled to the heat spreader window for removing the thermal energy from the DUT during its operation, wherein the heat exchanger is configured to allow access to the heat spreader window.
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