发明名称 System and apparatus for venting electronic packages and method of making same
摘要 An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.
申请公布号 US7956457(B2) 申请公布日期 2011.06.07
申请号 US20080326202 申请日期 2008.12.02
申请人 GENERAL ELECTRIC COMPANY 发明人 FILLION RAYMOND ALBERT;DUROCHER KEVIN M.;BURKE ELIZABETH A.;GORCZYCA THOMAS BERT;WOYCHIK CHARLES G.
分类号 H01L23/34 主分类号 H01L23/34
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