发明名称 Method for manufacturing semiconductor device comprising SOI transistors and bulk transistors
摘要 By forming bulk-like transistors in sensitive RAM areas of otherwise SOI-based CMOS circuits, a significant savings in valuable chip area may be achieved since the RAM areas may be formed on the basis of a bulk transistor configuration, thereby eliminating hysteresis effects that may typically be taken into consideration by providing transistors of increased transistor width or by providing body ties. Hence, the benefit of high switching speed may be maintained in speed-critical circuitry, such as CPU cores, while at the same time the RAM circuit may be formed in a highly space-efficient manner.
申请公布号 US7955937(B2) 申请公布日期 2011.06.07
申请号 US20060560896 申请日期 2006.11.17
申请人 ADVANCED MICRO DEVICES, INC. 发明人 WIECZOREK KARSTEN;HORSTMANN MANFRED;FEUDEL THOMAS;HELLER THOMAS
分类号 H01L21/331 主分类号 H01L21/331
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