发明名称 |
Method for recycling/reclaiming a monitor wafer |
摘要 |
The invention provides a method for recycling/reclaiming a monitor or test wafer and a method for testing an integrated circuit manufacturing process. After a monitor wafer has been used for testing one or more semiconductor wafer processing steps to determine adequacy for use with production wafers, deposited materials and other residues from the tested processing steps are removed, and the stripped wafer is subjected to a thermal anneal to repair defects in its surface and return it to a reusable condition.
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申请公布号 |
US7955956(B2) |
申请公布日期 |
2011.06.07 |
申请号 |
US20090621393 |
申请日期 |
2009.11.18 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BARRETT GARY C.;BUCHER BRADLEY D.;CARR COLIN L. |
分类号 |
H01L21/322;H01L21/00;H01L21/66 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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