发明名称 |
VERTICALLY STACKABLE DIES HAVING CHIP IDENTIFIER STRUCTURES |
摘要 |
<p>A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through silicon via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through silicon vias that are each hard wired to an external electrical contact.</p> |
申请公布号 |
WO2011044385(A3) |
申请公布日期 |
2011.06.03 |
申请号 |
WO2010US51860 |
申请日期 |
2010.10.07 |
申请人 |
QUALCOMM INCORPORATED;SUH, JUNGWON |
发明人 |
SUH, JUNGWON |
分类号 |
G11C5/00;G11C8/12;G11C16/20;H01L25/065 |
主分类号 |
G11C5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|