| 摘要 |
<p>Provided is titanium-copper that contains purposely precipitated TiCu3, which is a stable phase, and that, despite this, has excellent strength and bendability. The titanium-copper is a copper alloy for electronic components which contains 2.0-4.0 mass% Ti, the remainder comprising copper and incidental impurities. When a section of the copper alloy which is parallel to the rolling direction is examined for structure with an electron microscope, grain boundary reaction phases containing precipitated Ti-Cu-based particles are observed along the crystal grain boundaries. When the diameter of the maximum circle surrounded by the contour of each of the grain boundary reaction phases is expressed by D1 and the diameter of the minimum circle with which the grain boundary reaction phase is surrounded is expressed by D2, then the average of the D2/D1 ratios of the respective grain boundary reaction phases, Avg(D2/D1), is 1.0-6.0 and the average of the D1's, AvgD1, is 0.4-2.0 µm. Furthermore, the grain boundary reaction phases account for 1.5-15% of the field of view having an area of 1,000 µm2.</p> |
