SINGLE-COMPONENT EPOXY RESIN COMPOSITION AND USE THEREOF

摘要

The disclosed single-component epoxy resin composition hermetically seals an electronic component or an electric component, and contains a liquid epoxy resin, a dicyandiamide, and a filler. The average particle size of the abovementioned filler is in the range of 0.1-1 µm. The fraction of particles in the abovementioned filler having a particle size of at least 5 µm is no greater than 20% by weight. The amount of the abovementioned filler that is contained is in the range of 5-60 masses for every 100 masses of the abovementioned epoxy resin. As a result, a single-component liquid epoxy resin composition can be realized wherein many types of curing agents can be used, and the occurrence of separation of the epoxy resin and the curing agent at the time of use is suppressed even if there is a gap on the order of of tens of µm.