| 摘要 |
<p>Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a base (1) and a conductive pattern (5) provided on the base (1), wherein the conductive pattern (5), except for the surface on the reverse side from the base (1) and for the vicinity thereof, wholly has a structure comprising a binder (2) and fine aluminum particles (3) dispersed therein, and the conductive pattern (5) has, formed in the surface and the vicinity, a surface aluminum-metal layer (4) in which fine aluminum particles (3) have been rolled to form conductive connections among the fine particles.</p> |
